Intel CEO Lip-Bu Tan to Visit Odisha for Semiconductor Plant Groundbreaking; Chip Production Expected by 2027
India’s semiconductor ambitions are set to receive a major boost as Intel Corporation gears up for its first strategic involvement in a domestic chip packaging facility. Intel CEO Lip-Bu Tan is likely to visit Odisha later this year for the groundbreaking ceremony of the 3D Glass Solutions (3DGS) semiconductor packaging plant, according to senior officials…